Download 3D IC Stacking Technology by Banqiu Wu,Ajay Kumar,Sesh Ramaswami PDF

April 12, 2017 | Manufacturing | By admin | 0 Comments

By Banqiu Wu,Ajay Kumar,Sesh Ramaswami

The most modern advances in three-d built-in circuit stacking technology

With a spotlight on commercial functions, 3D IC Stacking Technology deals entire insurance of layout, try out, and fabrication processing tools for third-dimensional gadget integration. every one bankruptcy during this authoritative advisor is written by way of specialists and information a separate fabrication step. destiny functions and state-of-the-art layout strength also are mentioned. this is often a vital source for semiconductor engineers and conveyable equipment designers.

3D IC Stacking Technology covers:

  • High density via silicon stacking (TSS) technology
  • Practical layout environment for heterogeneous 3D IC products
  • Design automation and TCAD instrument suggestions for via silicon through (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical sprucing for TSV applications
  • Temporary and everlasting bonding
  • Assembly and try facets of TSV technology

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